Intellectual Property India Publishes Patent Application for 'Electronic Device Comprising Heat Pipe Surrounding Multiple Integrated Circuits' Filed by Samsung Electronics Co. Ltd.

MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517007687 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Jan. 30, for 'electronic device comprising heat pipe surrounding multiple integrated circuits.'

Inventor(s) include Yoon, Youngho; and Jung, Sangchul.

The application for the patent was published on Feb. 21, under issue no. 08/2025.

According to the abstract released by the Intellectual Property India: "An electronic device is provided. The electronic device may comprise a printed circuit board (PCB) including a first surface and a second surface opposite to the first surface. The electronic device may comprise a processor on the second surface. The electronic dev...