Intellectual Property India Publishes Patent Application for 'Electronic Device Comprising Heat Dissipation Member' Filed by Samsung Electronics Co. Ltd.

MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202517020259 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on March 6, for 'electronic device comprising heat dissipation member.'

Inventor(s) include Min Byeonguk.

The application for the patent was published on March 28, under issue no. 13/2025.

According to the abstract released by the Intellectual Property India: "An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge structure connected to the first housing and the second housing to enable the first housing and the second housing to be rotated while the electronic device changes the state there...