Intellectual Property India Publishes Patent Application for 'Electrically Conductive Contact Assembly, Module Connector, Connection Assembly And Method For Mechanical Fastening' Filed by Te Connectivity Solutions Gmbh

MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202544041206 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on April 29, for 'electrically conductive contact assembly, module connector, connection assembly and method for mechanical fastening.'

Inventor(s) include Eheim, Manuel; Stine, Adrian; Heldmann, Frank; Wolf, Marcus; Hoffmann, Bjoern; Distler, Patrick; Buchholz, Ron; and Schaefer, Maik.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to an electrically conductive contact assembly (100, 100', 100''), wherein the contact assembly (100, 1...