MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541132903 A) filed by R. M. K. Engineering College, Tiruvallur, Tamil Nadu, on Dec. 29, 2025, for 'eggshell empowerment: crafting eco-friendly prosthetic solutions.'
Inventor(s) include Savarna K; Vaishnavi D; Sushmitha B; Mohithaa N; Thangasakthi M; K. Chidambarathanu; S. Jhansi Ida; Anandaraj S; Jayaram B; and C. Mary Shiba.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "As the need for prosthetic devices rises, so does the need for more sustainable and environmentally friendly alternatives. Traditional prosthesis design and production frequ...