Intellectual Property India Publishes Patent Application for 'Efficient System-On-Chip Architecture For Maintaining Comfortable Temperature At Exterior Touchpoints In Vehicles' Filed by Mercedes-Benz Group Ag

MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202341079791 A) filed by Mercedes-Benz Group Ag, Stuttgart, Germany, on Nov. 24, 2023, for 'efficient system-on-chip architecture for maintaining comfortable temperature at exterior touchpoints in vehicles.'

Inventor(s) include Rohan Varghese; Nagashree Katta Subbaraju; Sutha Ganesan; and Vaishali Goyal.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "Present disclosure relates to a method and a system for maintaining a comfortable temperature at exterior touchpoints in a vehicle. The method comprising receiving an input signal authenticated by a ...