MUMBAI, India, May 16 -- Intellectual Property India has published a patent application (202517039393 A) filed by Unitika Ltd., Osaka, Japan, on April 24, for 'easily adhesive polyamide film and method for producing same.'

Inventor(s) include Kajita, Akito; and Kurosawa, Akiko.

The application for the patent was published on May 16, under issue no. 20/2025.

According to the abstract released by the Intellectual Property India: "[Problem] To provide an easily adhesive polyamide film that is superior in terms of blocking resistance, printability, transparency, etc. while maintaining high adhesion even after hot water treatment. [Solution] The present invention relates to an easily adhesive polyamide film in which a primer layer is formed o...