Intellectual Property India Publishes Patent Application for 'Devices And Methods For Microencapsulation' Filed by Hameed, Abdul Samad Abdul

MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202321086921 A) filed by Hameed, Abdul Samad Abdul, Maharashtra, on Dec. 19, 2023, for 'devices and methods for microencapsulation.'

Inventor(s) include Hameed, Abdul Samad Abdul; Patankar, Sandeep Prakash; Shinde, Ujwala A.; Shinde, Vijaya Dattatraya; Satpute, Snehal Rajendra; Parit, Utkarsha Bajirao; Mahadik, Ujjwala Ananda; and Narayankar, Aishwarya Chandrakant.

The application for the patent was published on June 20, under issue no. 25/2025.

According to the abstract released by the Intellectual Property India: "Microencapsulation, a process of entrapment of material in polymeric microcapsules, has been used for diverse purposes, such as increas...