MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511122355 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 5, 2025, for 'device for thermal-optimized power electronics packaging.'
Inventor(s) include Dr. Satinder Pal Singh; Dr. Swati Gupta; and Dr Dilraj Preet Kaur.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a device for thermal-optimized power electronics packaging designed to enhance heat dissipation, reduce thermal resistance, and improve reliability of semiconductor components operating under high power density and wide temperature...