MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079360 A) filed by Towa Corporation, Kyoto, Japan, on Aug. 21, for 'cutting device, cutting method, and method for manufacturing cut product.'
Inventor(s) include Watanabe Hajime; Ishibashi Kanji; Kataoka Shoichi; Sakamoto Rin; and Horimoto Kyotaro.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "Provided are a cutting device, a cutting method, and a method for manufacturing a cut product, with which it is possible to perform accurate half-cuts with little variability. The cutting device according to the present invention comprises a tab...