MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072381 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive and thermally conductive member.'
Inventor(s) include Furukawa, Atsushi; Iwamoto, Tatsuya; Kobayashi, Yuusuke; and Yoshioka, Tetsurou.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A curable thermally conductive adhesive containing a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive exhibits a reduction in mass of 1.5% or less after undergoing a temperature...