MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072379 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive, thermally conductive member, and battery assembly.'
Inventor(s) include Yoshioka, Tetsurou; Iwamoto, Tatsuya; Kobayashi, Yuusuke; Furukawa, Atsushi; Morimoto, Kohei; and Iino, Tatsuya.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "This curable thermally conductive adhesive contains a curable binder and a thermally conductive filler. A cured product of the curable thermally conductive adhesive has a tensile storage elastic m...