MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517059962 A) filed by Namics Corporation, Niigata, Japan, on June 23, for 'curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, and electronic device.'
Inventor(s) include Suzuki Fumiya; and Iwaya Kazuki.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having ...