MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202544023510 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on March 17, for 'connector kit, manufacturing method for a connector kit, and connection method to a connector kit.'
Inventor(s) include Keil, Kevin.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a connector kit (100) for connecting a shielded high-voltage conductor to an aggregate, the connector kit (100) comprising: a power connector (120) for contacting a cable core (144) of the shielded high-voltage conductor to a mating ...