MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202444063665 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Aug. 23, 2024, for 'connector housing assembly and connector.'
Inventor(s) include Veihl, Maximilian; Spataru, Florin; and Samstag, Maximilian.
The application for the patent was published on March 7, under issue no. 10/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a connector housing assembly (1) comprising: a connector housing (10) for receiving at least one electrical terminal; a pivotable lever (20) for mating the connector housing with a mating connector (30) along a mating direction (A), wherei...