MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202544023018 A) filed by Tyco Electronics Co. Ltd.; and Tyco Electronics Technology Co. Ltd., Shanghai, on March 14, for 'connector housing assembly, connector and connector assembly.'
Inventor(s) include Hu, Tomo; Li, Lei; Wang, Hai; Li, Jianxiong; and Zhang, Reicky.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a connector housing assembly, a connector and a connector assembly. The connector housing assembly comprises: a housing (10) which has two opposite sides in its transverse direction (X); and a locking...