Intellectual Property India Publishes Patent Application for 'Coil Conductor Attachment System And Method' Filed by Hsp Hochspannungsgerate Gmbh

MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202517084444 A) filed by Hsp Hochspannungsgerate Gmbh, Troisdorf, Germany, on Sept. 5, for 'coil conductor attachment system and method.'

Inventor(s) include Khan, Kamran; Lang, Andrew; and Alves, Sean.

The application for the patent was published on Sept. 26, under issue no. 39/2025.

According to the abstract released by the Intellectual Property India: "A coil conductor attachment system includes a termination bar, a coil end receiver barrel extending therefrom, a connector attaching the barrel to the bar, a conductor having a conductor end portion at least partially disposed within the barrel, and a crimped portion of the coil end receiver barre...