Intellectual Property India Publishes Patent Application for 'Climate Resilient Fungal Bioformulation For Seed Germination And Method Of Preparation Thereof' Filed by Dr. Abhishek Kumar; Pooja; and Dilbagh

MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123154 A) filed by Dr. Abhishek Kumar; Pooja; and Dilbagh, Ambala, Haryana, on Dec. 6, 2025, for 'climate resilient fungal bioformulation for seed germination and method of preparation thereof.'

Inventor(s) include Shabnam; Dr. Abhishek Kumar; Dr. Sultan Singh; Pooja; Manpreet Singh; Dilbagh; Dr. Sonu Langaya; and Dr. Mohit Kamboj.

The application for the patent was published on Jan. 23, under issue no. 04/2026.

According to the abstract released by the Intellectual Property India: "The invention relates to a climate resilient seed bioformulation comprising a combination of local fungal species namely Trichoderma asperellum, Penicillium chryso...