Intellectual Property India Publishes Patent Application for 'Circuit Board Module And Electronic Apparatus Including Same' Filed by Samsung Electronics Co. Ltd.

MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202527033291 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on April 4, for 'circuit board module and electronic apparatus including same.'

Inventor(s) include Jeon Jinhwan; Jung Kwangho; Cho Chihyun; and Ha Sangwon.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board disposed in the housing; a first component and a second component disposed on one surface of the circuit board; a shielding mold disposed on the one...