Intellectual Property India Publishes Patent Application for 'Chip Level Package Photodiode' Filed by Vishay Semiconductor Gmbh

MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202517046923 A) filed by Vishay Semiconductor Gmbh, Heilbronn, Germany, on May 15, for 'chip level package photodiode.'

Inventor(s) include Schmidt, Manuel.

The application for the patent was published on June 20, under issue no. 25/2025.

According to the abstract released by the Intellectual Property India: "A chip level package photodiode includes a first conductive layer located at a first side of the chip level package photodiode. A first contact is located at a second side of the chip level package photodiode. A dopant diffusion layer is formed between the first conductive layer and the first contact electrically connecting the first conductive...