Intellectual Property India Publishes Patent Application for 'Charge Modified Chitosan Cross-Linked Encapsulate' Filed by Encapsys, Llc

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517041699 A) filed by Encapsys, Llc, Appleton, U.S.A., on April 30, for 'charge modified chitosan cross-linked encapsulate.'

Inventor(s) include Feng, Linsheng; Bobnock, Robert Stanley; Bardsley, Travis Ian; Smets, Johan; Tahon, Cedric Marc; and Collu, Mattia.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "An improved polyurea and chitosan core-shell delivery particles encapsulating a benefit agent is described. Chitosan is pre-modified with a modifying compound which is cationic, anionic, or nonionic. Alternatively the modification is accom...