Intellectual Property India Publishes Patent Application for 'Cable Bundle, Method Of Manufacturing Cable Bundle, And Cable Bundle Manufacturing Apparatus' Filed by Fujikura Ltd.

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517038675 A) filed by Fujikura Ltd., Tokyo, on April 22, for 'cable bundle, method of manufacturing cable bundle, and cable bundle manufacturing apparatus.'

Inventor(s) include Maehara, Naoya; Luo, Shengyang; and Namazue, Akira.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "A cable bundle 1 comprises a plurality of bundle units 10A-10C stacked in a second direction D3 orthogonal to a first direction that is the circumferential direction D1 of the cable bundle 1. The bundle units 10A-10C are respectively provided with first loops 20A-20C and...