MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079713 A) filed by Nippon Steel Corporation, Tokyo, on Aug. 22, for 'bonded/joined structure.'
Inventor(s) include Hasegawa, Masumi; Mitsunobu, Takuya; and Ueno, Shin.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "[Problem] To provide a bonded/joined structure which exhibits more excellent bonding durability, while maintaining red rust resistance. [Solution] A bonded/joined structure according to the present invention comprises a first member, a second member and an adhesive layer that joins the first member and the second member to ea...