Intellectual Property India Publishes Patent Application for 'Bonded Abrasive With Low Wetting Bond Material' Filed by Saint-Gobain Abrasives, Inc.; and Saint-Gobain Abrasifs

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517042291 A) filed by Saint-Gobain Abrasives, Inc.; and Saint-Gobain Abrasifs, Worcester, U.S.A., on May 1, for 'bonded abrasive with low wetting bond material.'

Inventor(s) include Wang, Qing; Lin, Guangyong; Sarangi, Nilanjan; Luo, Zhenyu; and Lu, Lu.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol%. The body also can include a) an ave...