MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202517055395 A) filed by Saga Computer Numerical Control Co. Ltd., Anhui, China, on June 9, for 'board creasing and cutting device and method for packaging box production.'
Inventor(s) include Chen, Hong.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "A board creasing and cutting device and method for packaging box production, the device comprising: a packaging box board (10); a housing (1); a feeding mechanism (9); a scanning assembly (28); an identification mechanism (8), which is used for identifying side lines and identification point posit...