Intellectual Property India Publishes Patent Application for 'Biobased, Eco-Friendly Holtmelt Adhesive' Filed by Thueringisches Institut Fuer Textil- Und Kunststoff Forschung E. V.

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202444085428 A) filed by Thueringisches Institut Fuer Textil- Und Kunststoff Forschung E. V., Rudolstadt, Germany, on Nov. 7, 2024, for 'biobased, eco-friendly holtmelt adhesive.'

Inventor(s) include Krypczyk, Andreas.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "The invention describes an eco-friendly hotmelt adhesive based on renewable raw materials. The hotmelt adhesive formulation is made up of biobased polyesters, specifically a combination of polylactide and polybutylene succinate, and also of resins, 10 plasticizers and stabilizers; furthe...