MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202527032306 A) filed by Qualcomm Incorporated, San Diego, on April 1, for 'beam and secondary component carrier selection for downlink and uplink.'
Inventor(s) include Agarwal, Rishav; and Karakkad Kesavan Namboodiri, Vishnu Namboodiri.
The application for the patent was published on May 9, under issue no. 19/2025.
According to the abstract released by the Intellectual Property India: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may perform first measurements associated with secondary component carriers (SCCs) for downlink and perform second measurements associated with ...