MUMBAI, India, April 25 -- Intellectual Property India has published a patent application (202424031899 A) filed by Hyundai Mobis Co. Ltd., Seoul, Republic of Korea, on April 22, 2024, for 'battery module housing with anti-slip guide structure.'
Inventor(s) include Park, Lee Seung; and Jang, Jae Young.
The application for the patent was published on April 25, under issue no. 17/2025.
According to the abstract released by the Intellectual Property India: "Provided is a battery module housing with an anti-slip guide structure to prevent its product or jig from being deformed, and more particularly, to the battery module housing including: an upper housing, a lower housing, a front housing, and a rear housing, respectively disposed on the u...