MUMBAI, India, April 25 -- Intellectual Property India has published a patent application (202517029944 A) filed by Aarhus Universitet, Aarhus, Denmark, on March 28, for 'base-mediated deconstruction of epoxy resins.'
Inventor(s) include Sun, Hongwei; Ahrens, Alexander; and Skrydstrup, Troels.
The application for the patent was published on April 25, under issue no. 17/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for disassembly of epoxy-based polymers, the method comprising chemical manipulations to a cured epoxy resins involving a mixture of at least one organic solvent and a base. Specifically, the epoxy-based polymer is an amine-cured epoxy resin and the base ...