MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202527015903 A) filed by Qualcomm Incorporated, San Diego, on Feb. 24, for 'bandwidth part configurations for mixed half duplex and subband full duplex communications.'
Inventor(s) include Zhang, Qian; Zhou, Yan; Abdelghaffar, Muhammad Sayed Khairy; and Luo, Tao.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive configuration information indicative of a subband full duplex (SBFD) configuration for communicating...