Intellectual Property India Publishes Patent Application for 'Automated Wire Bundle Wrapping Device' Filed by Teerthanker Mahaveer University

MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411019161 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on March 15, 2024, for 'automated wire bundle wrapping device.'

Inventor(s) include Manish Joshi.

The application for the patent was published on Sept. 26, under issue no. 39/2025.

According to the abstract released by the Intellectual Property India: "An automated wire bundle wrapping device, comprising a frame having a platform 1 to be positioned on a fixed surface crafted with a slot 2 for accommodating a wire bundle for wrapping, an artificial intelligence-based imaging unit 3 installed on the platform 1 for capturing multiple images of the platform 1, multiple ...