MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202411024888 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 27, 2024, for 'automated stamp application device.'

Inventor(s) include Divya.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "An automated stamp application device comprises a housing 1 configured with motorized omnidirectional wheels, a touch interactive display panel 3 installed over the housing 1 to provide an input, a motorized sliding unit 4 installed at bottom portion of the chamber to provide translation to the ...