MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012987 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 22, 2024, for 'automated soil ripping device.'
Inventor(s) include Gurpreet Singh.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An automated soil ripping device, comprising a telescopically operated frame 1 attached with a handle 4 gripped by user to position two C-shaped members 5 on surface and distance between member 5 and surface is detected by a proximity sensor, multiple hinge joints tilt multiple T-shaped p...