MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012910 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 22, 2024, for 'assistive device for removing maize kernels.'
Inventor(s) include Amandeep Singh.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An assistive device for removing maize kernels, comprising a platform 1 attached with a C-shaped clamping unit 3 mounted on the platform 1 for securing a maize placed over the clamping unit 3 as detected by a weight sensor embedded on the platform 1, a cutting arrangement 4 ...