Intellectual Property India Publishes Patent Application for 'Articles Of Manufacture Relating To Ic Modules And Smart Cards' Filed by Smartflex Technology Pte Ltd.

MUMBAI, India, Feb. 7 -- Intellectual Property India has published a patent application (202417081547 A) filed by Smartflex Technology Pte Ltd., Singapore, on Oct. 25, 2024, for 'articles of manufacture relating to ic modules and smart cards.'

Inventor(s) include Ng, Eng Seng; and Pang, Sze Yong.

The application for the patent was published on Feb. 7, under issue no. 06/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure relates to carrier tapes, IC modules, and smart card devices. According to one embodiment, an article of manufacture comprises: a non-conductive substrate having a front side and a rear side, and a plurality of through holes extending from the front side to the rear side; ...