Intellectual Property India Publishes Patent Application for 'Array Of Heat-Sinked Power Semiconductors' Filed by American Axle & Manufacturing, Inc.

MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001981 A) filed by American Axle & Manufacturing, Inc., Detroit, on Jan. 9, for 'array of heat-sinked power semiconductors.'

Inventor(s) include Ronning, Jeffrey, J.

The application for the patent was published on Feb. 21, under issue no. 08/2025.

According to the abstract released by the Intellectual Property India: "An array of heat-sinked power semiconductors that includes a power semiconductor and a heat sink. The power semiconductor has a power semiconductor die, a plurality of first terminals and a second terminal. The power semiconductor die has a plurality of semiconductor terminals. Each of the first terminals is electrically coupled ...