MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517043944 A) filed by Avery Dennison Corporation, Mentor, U.S.A., on May 6, for 'architectured polymers and related methods.'
Inventor(s) include Bottorf, William, L.; Fang, Yunli; Full, Andrew, P.; Hu, Xiaochuan; Schunk, Timothy; Shelmire, Colby, D.; and Waterman, Michael, T.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "Pressure sensitive adhesives that include architectured polymers are described. Also described are various methods for producing the noted polymers and pressure sensitive adhesives. In addition, a variety of articles includi...