Intellectual Property India Publishes Patent Application for 'Antenna Module Implemented In Multi-Layer Package And Electronic Device Comprising The Same' Filed by Lg Electronics Inc.

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202414053470 A) filed by Lg Electronics Inc., Seoul, Republic of Korea, on July 12, 2024, for 'antenna module implemented in multi-layer package and electronic device comprising the same.'

Inventor(s) include Yusuhk Suh; Dongik Lee; and Seungmin Woo.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array ...