MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202347060865 A) filed by Teraoka Seisakusho Co. Ltd., Tokyo, on Sept. 11, 2023, for 'adhesive sheet.'
Inventor(s) include Ogino, Shohei; Ishikawa, Kazuki; Iwakami, Yuuki; and Tsuchiya, Yasushi.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Disclosed is an adhesive sheet having an adhesive layer (A1L) that is solid at 18 C, wherein the adhesive layer (A1L) includes an epoxy resin, the adhesive sheet has a pressure-sensitive adhesive region (A2R) formed by partially providing a pressure-sensitive adhesive (A2) on at least one surface of the adhe...