MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517099030 A) filed by Soken Chemical & Engineering Co. Ltd., Tokyo, on Oct. 14, for 'adhesive composition and method for manufacturing adhesive layer.'
Inventor(s) include Takizawa Youichi.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a pressure-sensitive adhesive composition comprising a (meth)acrylic polymer and an organic solvent, wherein the organic solvent includes an alcohol-based organic solvent and the solid concentration is 50 mass% or higher. The present invention also relates to a method for prod...