MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517052886 A) filed by Dic Corporation, Tokyo, on May 30, for 'adhesive composition, multilayer body and packaging material.'
Inventor(s) include Okada Katsuhiko; Kimura Ryouji; Takeda Miho; Watanabe Toshio; Wakahara Keisuke; Yamamoto Shinya; and Okino Kouhei.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Disclosed are: an adhesive composition which is composed of a fat or oil (A) having an acid anhydride group and a curing agent (H), wherein the curing agent (H) contains an acid-modified polyol (B) and an amine compound (C); a multilayer bo...