Intellectual Property India Publishes Patent Application for 'Actuator For A Heat Pump Valve Assembly, Valve Assembly For A Heat Pump And Heat Pump With A Valve Assembly' Filed by Danfoss A/S

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517037696 A) filed by Danfoss A/S, Nordborg, Denmark, on April 18, for 'actuator for a heat pump valve assembly, valve assembly for a heat pump and heat pump with a valve assembly.'

Inventor(s) include Frank, Mikkel; and Therkildsen, Kristian.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "The present invention pertains to an actuator for a heat pump valve assembly. The actuator comprises a motor, a metallic housing and a heat management assembly with a metallic bottom flange portion, a metallic upper flange portion and a thermal insulating ...