MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202527013548 A) filed by Byd Company Limited, Guangdong, China, on Feb. 17, for 'active solder paste composition for cladding ceramic with copper, method for cladding ceramic with copper, and copper-clad ceramic.'
Inventor(s) include Zhou, Wei; Xu, Qiang; Liu, Weiwei; and Wu, Lei.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "An active solder paste composition for cladding ceramic with copper, a method for cladding ceramic with copper, and copper-clad ceramic. The active solder paste composition comprises, on the basis of the total weight of...