MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202534022124 A) filed by Taikisha Ltd., Tokyo, on March 12, for 'abrasive separation apparatus and control method for abrasive separation apparatus.'
Inventor(s) include Suzuki, Hiroyuki; and Hasegawa, Chikara.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "An abrasive separation apparatus (10) comprising: a plate-shaped separation member (40) to be inserted between an attachment portion (21) with an abrasive (22) attached and the abrasive; a control unit (301) configured to relatively move the attachment portion with the abrasive attached an...