Intellectual Property India Publishes Patent Application for 'A Rational System For Testing Resilient Modulus Of Unbound Granular Materials' Filed by Indian Institute Of Technology

MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202431035283 A) filed by Indian Institute Of Technology, Bhubaneswar, Orissa, on May 3, 2024, for 'a rational system for testing resilient modulus of unbound granular materials.'

Inventor(s) include Dr. Umesh Chandra Sahoo; Tanmaya Kumar Barik; and Dr. Venugopal Arumuru.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "Resilient Modulus of unbound granular layer is one of the major parameters in pavement design procedure. However, the use of membrane to enclose the specimen in conventional repeated load triaxial test procedure makes the compaction ...