Intellectual Property India Publishes Patent Application for 'A Power Modules And Panel-Level Methods Of Making The Same' Filed by Pep Innovation Pte. Ltd.

MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202424094167 A) filed by Pep Innovation Pte. Ltd., Singapore, on Nov. 30, 2024, for 'a power modules and panel-level methods of making the same.'

Inventor(s) include Chew, Hwee Seng; and Kumar, Munirathinam Senthil.

The application for the patent was published on June 20, under issue no. 25/2025.

According to the abstract released by the Intellectual Property India: "The present application discloses a power module having a semiconductor package in which all the interconnections are formed by direct Copper (Cu). In this way, the power module is suitable for high power efficiency. In addition, the direct Copper (Cu) interconnection also enhances heat...