MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517007822 A) filed by Kordsa Teknik Tekstil Anonim Sirketi; and Ses Rfid Solutions Gmbh, Izmit, Turkey, on Jan. 30, for 'a pack for mounting an electronic device to a tire.'
Inventor(s) include Taman Onen, Ezgi; Ilgun, Ahmet Burak; Askin, Sule; Fidan, Mehmet Saadettin; Yilmaz, Mehmet Ilker; Lee, Yu Cheng; Chao, Ping Jung; and Scattergood, Martin.
The application for the patent was published on Feb. 21, under issue no. 08/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to an electrical device pack comprising an adhesive layer deposited onto a transfer layer, an electrical device, such as ...