MUMBAI, India, Aug. 1 -- Intellectual Property India has published a patent application (202411005741 A) filed by Indian Institute Of Technology, Ropar, Punjab, on Jan. 29, 2024, for 'a multi-purpose test rig for thermal performance evaluation of metallic structures.'
Inventor(s) include Kishore, Hreetabh; Nirala, Chandrakant Kumar; and Agrawal, Anupam.
The application for the patent was published on Aug. 1, under issue no. 31/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a multi-purpose test rig for thermal performance evaluation of metallic structures. The test rig powered by constant power supply, comprises upper (2) and lower part (12) in connection with locking nuts (1)...