Intellectual Property India Publishes Patent Application for 'A Low-Residue High Temperature-Resistant Dry Adhesive And Methods Of Use' Filed by Shin-Etsu Chemical Co. Ltd.

MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517058958 A) filed by Shin-Etsu Chemical Co. Ltd., Tokyo, on June 19, for 'a low-residue high temperature-resistant dry adhesive and methods of use.'

Inventor(s) include Aksak, Burak; and Geikowsky, Elliot.

The application for the patent was published on July 4, under issue no. 27/2025.

According to the abstract released by the Intellectual Property India: "A dry adhesive microfiber array comprising a plurality of fibers with tips adapted to contact a surface, where the dry adhesive is capable of adhering to the surface at elevated temperatures. The bonding strength of the dry adhesive remains constant or increases with increasing substrate/dry ad...