MUMBAI, India, April 4 -- Intellectual Property India has published a patent application (202311066341 A) filed by Indian Institute Of Technology, Jodhpur, Rajasthan, on Oct. 3, 2023, for 'a light-weight as-cast high-entropy alloy and processes thereof.'
Inventor(s) include Nene, S. S.; and Balpande, A. R.
The application for the patent was published on April 4, under issue no. 14/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure provides a high-entropy alloy represented by the Formula I, TiaVbNbcAldXe, (Formula I), wherein a, b, c, d, and e represent 5 atomic percentages of Ti, V, Nb, Al, and X respectively, wherein a is at least 50 at.%; b is in a range of 10 to 20 at.%; c is in a rang...