MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202311055273 A) filed by Indian Council Of Medical Research; and Indian Spinal Injuries Centre, New Delhi, on Aug. 17, 2023, for 'a biodegradable scaffold for deep wound healing and methods for preparation and application thereof.'
Inventor(s) include Nagpal, Puja Sawhney; Kesarwani, Ashwani; and Chhabra, Harvinder Singh.
The application for the patent was published on Feb. 21, under issue no. 08/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure generally relates to the field of biomedical technology and tissue engineering. Particularly, the present disclosure relates to a biodegradable scaffold for...